Curated semiconductor and AI infrastructure intelligence — sourced, verified, and continuously updated.
All figures are illustrative estimates only. Sourced from public announcements and analyst reports — approximated for demo purposes. Not for investment, trading, or business decisions.
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xAI's Colossus cluster in Memphis, Tennessee is reportedly expanding from 100K to over 200K GPU capacity using NVIDIA H100 and H200 systems. The facility is used for training Grok AI models. Power supply expansion is reportedly a key constraint. [DEMO est.]
SMIC's most advanced N+2 (~7nm-class) process uses complex DUV multi-patterning in the absence of EUV lithography. Yield improvement and capacity expansion are progressing but constrained by lithography limitations imposed by US export controls. [DEMO est.]
Samsung Foundry's Taylor, Texas fab is reportedly facing delays in its construction and production ramp timeline. Original 2024 production targets have been pushed back. The facility targets SF4/SF2 production with $17B in planned investment. [DEMO est.]
AMD's MI300X accelerator with 192GB HBM3 is gaining significant traction as an H100/H200 alternative for large-context AI inference workloads. Microsoft Azure, Oracle, and Meta have publicly confirmed MI300X deployments. [DEMO est.]
TSMC secured a $6.6B direct grant and up to $5B in loans under the CHIPS and Science Act for its three planned Arizona fabs (N4P, N2, and A16 phases). Production on Phase 2 (N2) is targeted for 2028. [Public record]
Cerebras Systems has made its WSE-3 wafer-scale AI accelerator generally available. At 125,000 TFLOPS (FP16) and 44GB on-chip SRAM, the WSE-3 eliminates HBM dependency and CoWoS packaging constraints. TSMC N5 full-wafer production. [DEMO est.]