FabDashboardSemi Intelligence
Demo Data — MVP
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FabDashboard v0.1 MVP
Data is illustrative only.
Not for investment use.

FabDashboardBottleneck Index
⚠Demo Data

Supply Chain Bottleneck Index

Pressure scores (0–100) across key semiconductor supply chain layers. Higher scores indicate greater constraint risk.

Avg Pressure
61
/ 100

All figures are illustrative estimates only. Sourced from public announcements and analyst reports — approximated for demo purposes. Not for investment, trading, or business decisions.

Critical ≥80
2
indicators
Elevated ≥60
3
indicators
Moderate ≥40
4
indicators
Low <40
1
indicator
Critical Constraints (2)
HBM3e Memory — 88CoWoS-L Packaging — 82

Pressure Overview

88
HBM3e Memory
Stable
82
CoWoS-L Packaging
Easing
78
Taiwan Geopolitical Risk
Stable
75
TSMC N3/N2 Wafer Capacity
Increasing
65
AI Datacenter Power (US)
Increasing
58
Intel 18A Yield Risk
Easing
52
ABF Substrates
Easing
45
CoWoS-S Packaging
Stable
40
TSMC N5/N4 Wafer Capacity
Stable
25
SoIC Advanced Packaging
Increasing

Detailed Breakdown

Memory / HBM
HBM3e Memory

SK Hynix HBM3e fully allocated to NVIDIA through 2025. Micron/Samsung ramping. [est.]

Source: SK Hynix Q3 2024 Earnings · 2025-Q1
Pressure88
Stable
HIGH
Packaging
CoWoS-L Packaging

TSMC CoWoS-L capacity constrained vs AI GPU demand. Expansion ongoing. Single-source dependency. [est.]

Source: TSMC Earnings / Analyst 2024 · 2025-Q1
Pressure82
Easing
MED
CoWoS-S Packaging

CoWoS-S (bridge interposer) capacity more relaxed than CoWoS-L. Used for smaller multi-die designs. [est.]

Source: Industry Reports — DEMO est. · 2025-Q1
Pressure45
Stable
LOW
SoIC Advanced Packaging

SoIC-X early ramp. Limited volume, pre-production. Key technology for future Rubin-era chips. [est.]

Source: TSMC OIP Forum 2023 — DEMO est. · 2025-Q1
Pressure25
Increasing
LOW
Geopolitical
Taiwan Geopolitical Risk

~90% of sub-5nm global capacity in Taiwan. Structural concentration risk with no near-term resolution. [est.]

Source: SEMI / Analyst Consensus — DEMO · 2025-Q1
Pressure78
Stable
HIGH
Wafer Capacity
TSMC N3/N2 Wafer Capacity

Leading-edge N3E/N2 demand exceeds current supply. Apple, NVIDIA, AMD competing for allocation. [est.]

Source: TSMC Q4 2024 / Analyst consensus · 2025-Q1
Pressure75
Increasing
MED
Intel 18A Yield Risk

Intel 18A yield uncertain at risk production stage. External customer ramp dependent on yield improvement. [est.]

Source: Industry Analyst Reports — DEMO est. · 2025-Q1
Pressure58
Easing
LOW
TSMC N5/N4 Wafer Capacity

N5/N4 capacity largely met for current demand. H100 still on N4; demand shifting to N3/N2. [est.]

Source: Analyst Reports — DEMO est. · 2025-Q1
Pressure40
Stable
MED
Power Infrastructure
AI Datacenter Power (US)

Power grid constraints becoming active limiter in NoVA, Texas, PNW datacenter markets. [est.]

Source: IEA / Industry Reports — DEMO est. · 2025-Q1
Pressure65
Increasing
MED
Substrates
ABF Substrates

ABF substrate supply tight but expanding. Ibiden/Shinko capacity ramp expected 2025. [est.]

Source: Industry Reports — DEMO est. · 2025-Q1
Pressure52
Easing
LOW
Score Guide
80–100 — Critical constraint, active impact expected60–79 — Elevated pressure, monitor closely40–59 — Moderate, tracking required0–39 — Low pressure, within normal range