FabDashboard maps the physical infrastructure powering AI — semiconductor fabs, chip supply chains, advanced packaging, power grids, strategic risks, and infrastructure scenarios — into a single intelligence platform.
DEMO DATA — illustrative counts only
INTELLIGENCE MODULES
TSMC, Intel Foundry, Samsung, GlobalFoundries — fab locations, status, and capacity estimates.
3nm, 2nm, Intel 18A, Samsung SF3E — node status, yield estimates, and mass production timelines.
CoWoS-L, SoIC, HBM integration — bottleneck analysis and capacity estimates for advanced packaging.
Hyperscale AI clusters, H100/GB200 deployments, power capacity and operator breakdowns.
Geographic concentration, supplier dependency, CoWoS bottleneck — exposure scores across 7 risk categories.
CoWoS doubles, Taiwan disruption, HBM4 shortage — infrastructure scenario analysis with impact vectors.
Regional grid utilization, AI cluster demand, power constraints in NoVA, Texas, Taiwan, Ireland.
AI accelerator and datacenter silicon market estimates. 2022–2028 illustrative forecasts.
Interactive world map of semiconductor fab locations, datacenter clusters, and supply chain nodes.
Visual dependency map — NVIDIA → TSMC → CoWoS → SK Hynix. Illustrative supply chain topology.
A hypothetical next-generation fab concept — illustrating future semiconductor infrastructure scenarios. Not a real company or real data. View speculative section →