Illustrative dependency graph — chip designers, foundries, packaging, memory, and hyperscalers.
This diagram is a simplified, illustrative representation of AI chip supply chain relationships. Actual supply chain arrangements, volumes, and partnerships are confidential and may differ significantly. All labels marked [est.] are analyst estimates. Not for investment or business decisions.
CoWoS Packaging
Advanced CoWoS substrate capacity at TSMC identified as a key constraint for H100/H200 GPU supply in 2023–2024.
[DEMO est. — illustrative only]
HBM3e Memory
SK Hynix primary supplier of HBM3e for NVIDIA H200/GB200. Tight 2024–2025 supply outlook per analyst estimates.
[DEMO est. — illustrative only]
TSMC N3 Capacity
Leading-edge N3E/N3P node demand from Apple, NVIDIA, AMD, and hyperscaler custom silicon constrained through 2025.
[DEMO est. — illustrative only]
* All supply chain data is illustrative only. Sourced from public analyst reports and company announcements. Real arrangements are confidential. Not for investment use.