Key milestones across fabs, process nodes, AI chips, and advanced packaging. 2022–2027 semiconductor roadmap.
Timeline milestones are sourced from public company announcements, earnings calls, and analyst estimates. Future milestones (2025+) are illustrative estimates. Dates labeled [est.] are not confirmed. Not for investment decisions.
17
Total Milestones
8
Completed
8
On Track / Future
1
Delayed
0
Speculative
Fab
Samsung Taylor Fab (Texas)
Taylor Fab Construction
AI Chip
NVIDIA H100 SXM5
H100 General Availability
Process Node
TSMC N3
N3 Mass Production
Process Node
TSMC N3E
N3E Mass Production
Packaging
CoWoS-L
CoWoS Supply Constraint
Fab
TSMC Fab 21 Ph2 (Phoenix)
Fab 21 Ph2 Construction
AI Chip
AMD MI300X
MI300X General Availability
Packaging
HBM3e Stack
HBM3e Ramp for Blackwell
Process Node
Samsung SF3E
SF3E Mass Production
Fab
TSMC Fab 21 Ph1 (Phoenix)
Fab 21 Ph1 Ramping
AI Chip
NVIDIA H200 SXM5
H200 General Availability
Process Node
TSMC N2
N2 Mass Production
AI Chip
NVIDIA B200/GB200
Blackwell Production Ramp
Process Node
Intel 18A
Intel 18A Risk Production
Fab
Intel Fab 52/62 (Chandler)
Intel 18A Production Ramp
Process Node
TSMC N2P
N2P Mass Production
Taylor Fab Construction
Samsung Taylor TX fab breaks ground. $17B CHIPS Act investment.
H100 General Availability
NVIDIA H100 SXM5 enters general availability. Transforms AI training market.
N3 Mass Production
TSMC N3 FinFET enters mass production. Apple A17 lead customer.
N3E Mass Production
Enhanced N3E — improved yield, better PPA. Main N3-family volume node.
CoWoS Supply Constraint
TSMC CoWoS-L identified as key constraint limiting AI GPU supply growth.
Fab 21 Ph2 Construction
TSMC Arizona Phase 2 (N2) construction begins. $13B investment.
MI300X General Availability
AMD MI300X with 192GB HBM enters GA. Strong inference competitor to H100.
HBM3e Ramp for Blackwell
SK Hynix HBM3e ramp prioritized for NVIDIA Blackwell. Tight supply 2024–2025.
SF3E Mass Production
Samsung 3nm GAA (SF3E) volume ramp. First GAA node in mass production industry-wide.
Fab 21 Ph1 Ramping
TSMC Arizona Fab 21 Phase 1 (N4P) enters production ramp.
H200 General Availability
H200 (H100 die + HBM3e) enters GA. Key memory capacity uplift for LLMs.
N2 Mass Production
TSMC's first GAA (nanosheet) node at 2nm-class. Apple A20 lead customer.
Blackwell Production Ramp
GB200 NVL72 rack begins shipping to hyperscalers. CoWoS supply key constraint.
Intel 18A Risk Production
Intel 18A RibbonFET + PowerVia enters risk production phase. CHIPS Act milestone.
Intel 18A Production Ramp
Intel Chandler fabs targeting Intel 18A production ramp. CHIPS Act beneficiary.
N2P Mass Production
N2P — backside power delivery rail option (BSPDN). Performance uplift.
Fab 21 Ph2 Target Ramp
N2 production ramp target. Delayed from original 2026 target. [est.]
* All future dates are illustrative estimates. Sources noted per milestone. Delayed = behind original schedule per public reporting. Not for investment use.