Curated semiconductor and AI infrastructure intelligence — sourced, verified, and continuously updated.
All figures are illustrative estimates only. Sourced from public announcements and analyst reports — approximated for demo purposes. Not for investment, trading, or business decisions.
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Microsoft announced plans to invest approximately $80B in AI-capable datacenter infrastructure in fiscal year 2025, with over half allocated to US facilities. The investment is focused on training large AI models and deploying Azure AI services globally. [DEMO est.]
Intel Foundry has confirmed that Intel 18A — featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery — has entered risk production at its Chandler, Arizona fabs. This is a key milestone for Intel's foundry turnaround strategy. [est.]
SK Hynix announced that its HBM3e (12-hi, 36GB per stack) production capacity is effectively fully allocated through end of 2025, with NVIDIA as the primary customer. Micron and Samsung are ramping alternative supply but face qualification lead times. [DEMO est.]
TSMC has confirmed N2 (2nm-class GAA nanosheet) is on track for mass production in 2025. Apple A20 chip series is identified as the lead customer. N2 delivers approximately 10-15% performance uplift over N3E at similar power. [est.]
TSMC's first US fab in Phoenix, Arizona has entered volume production on the N4P process node. Apple is the lead customer for A16 chip production. The facility represents a $12B investment supported by the US CHIPS and Science Act.
The US Department of Commerce finalized an $8.5B CHIPS Act direct grant to Intel for expansion of domestic semiconductor manufacturing, including Fab 52 and Fab 62 in Chandler, Arizona targeting Intel 18A production. Additional $11B in loans announced. [Public record]