FabDashboard is designed around epistemic honesty — every data point carries explicit confidence attribution. This page explains how intelligence is classified, verified, and presented.
Every intelligence item, chip specification, capacity estimate, and scenario carries a confidence level. These levels reflect the reliability of the underlying source, not the importance of the data point.
Sourced directly from official communications: earnings calls, official press releases, SEC filings, government announcements.
Sourced from formal investor materials, technology symposia, or corroborated across multiple credible sources.
Analyst estimates, industry reports, or credible single-source journalism. Some uncertainty present.
Single unverified source, rumor, or data point with significant uncertainty. Treated as directional signal only.
Entirely hypothetical, forward-looking, or scenario-modeled. Not grounded in primary source evidence.
Intelligence items move through a verification pipeline before being published. The Operations view shows each item's current verification state.
Confirmed against primary source documentation.
Being cross-referenced against secondary sources. Confidence may change.
Data is outdated or forward-looking. Requires periodic refresh.
Awaiting initial analyst review.
Contradictory sources found. Treat with caution.
Found to be inaccurate or retracted. Removed from active feed.
Each intelligence item is tagged with a category reflecting its primary infrastructure domain.
Component sourcing, supplier relationships, logistics, and supply disruption events.
Fab, packaging, and memory capacity expansions, constraints, and allocation dynamics.
Export controls, trade policy, government intervention, and cross-border risk.
U.S. CHIPS and Science Act grants, policy implementation, and domestic manufacturing.
Advanced packaging technology developments: CoWoS, SoIC, HBM integration.
HBM, GDDR, LPDDR memory supply, capacity, and technology transitions.
Semiconductor process technology milestones, yield progress, and node transitions.
Hyperscale and AI datacenter capacity, power, and deployment developments.
Corporate events, executive changes, financial results, and strategic announcements.
AI chip product launches, roadmap changes, and deployment milestones.
Intelligence items and bottleneck indicators carry severity scores reflecting potential infrastructure impact — not financial materiality.
Imminent or active system-level impact. Structural constraint with no near-term mitigation.
Significant constraint identified. Requires active monitoring and strategic consideration.
Notable development with monitoring required. Directional signal rather than active constraint.
Minor signal. Informational context for longer-term infrastructure awareness.
Background context. No active constraint implied.
Scenario models on FabDashboard are analytical thought experiments — not predictions, forecasts, or investment models. They explore how hypothetical infrastructure changes might propagate through the supply chain.
All magnitude scores, impact directions, and scenario outputs are illustrative estimates. Scenario confidence is always LOW or SPECULATIVE by design.
All data currently shown in FabDashboard is illustrative demo data.
Numbers, capacities, prices, timelines, and estimates are approximations drawn from publicly available sources — earnings calls, analyst reports, industry publications — and are simplified for demonstration purposes. They should not be used for investment decisions, business planning, or financial purposes.
FabDashboard is not affiliated with any semiconductor company, financial institution, or government agency.