Curated semiconductor and AI infrastructure intelligence — sourced, verified, and continuously updated.
All figures are illustrative estimates only. Sourced from public announcements and analyst reports — approximated for demo purposes. Not for investment, trading, or business decisions.
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Intel Foundry has confirmed that Intel 18A — featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery — has entered risk production at its Chandler, Arizona fabs. This is a key milestone for Intel's foundry turnaround strategy. [est.]
TSMC has confirmed N2 (2nm-class GAA nanosheet) is on track for mass production in 2025. Apple A20 chip series is identified as the lead customer. N2 delivers approximately 10-15% performance uplift over N3E at similar power. [est.]
SMIC's most advanced N+2 (~7nm-class) process uses complex DUV multi-patterning in the absence of EUV lithography. Yield improvement and capacity expansion are progressing but constrained by lithography limitations imposed by US export controls. [DEMO est.]